- 19 February 2004 10:52
Intel Silicon, Platform Innovations Speed Advances In Mobile Computing
Intel Silicon, Platform InnovationsSpeed Advances In Mobile Computing
INTEL DEVELOPER FORUM, SAN FRANCISCO, 19 February, 2004 – From new audio and video experiences to closed-lid access to email, Intel Corporation today showed how the evolving capabilities of mobile computing are attracting new users and creating new opportunities for developers.
New mobile products, platform innovations and industry enabling programs are helping to grow both the overall size of the notebook market segment and the number of notebooks sold as a percentage of total PC shipments, said Anand Chandrasekher, Intel vice president and general manager of Intel’s Mobile Platforms Group. Speaking at the Intel Developer Forum, Chandrasekher outlined Intel’s plans to enhance Intel® Centrino™ mobile technology and the Intel Pentium® M processor. He also highlighted new concept mobile PCs with features designed to reshape mobile computing for a wide variety of users.
“In the last year, enterprise customers have repeatedly told us that a laptop based on Intel Centrino mobile technology is the best laptop available,” said Chandrasekhar. “With compelling new mobile platform capabilities and the tremendous industry momentum around Wi-Fi and Intel Centrino mobile technology, we envision a rise in new and innovative applications for mobile computing in both the enterprise and the home.”
Driving Momentum Through Silicon Innovation Intel’s product roadmap for 2004 will further advance the mobile computing experience with even higher performance and more wireless connectivity choices, and by enabling longer battery life in thin and light designs. In the second quarter of 2004, Intel plans to introduce a higher-performing Intel Pentium M processor (code-named “Dothan”), and in the second half of 2004 Intel plans to update all the elements of Intel Centrino mobile technology with the “Sonoma” platform introduction. Sonoma includes a new Intel Pentium M processor with a faster, 533 MHz front-side bus; a new Wi-Fi component that supports the 802.11a, 802.11b and 802.11g wireless networking standards; and, a new chipset code-named “Alviso.” The chipset will support third-generation graphics and enable support for devices and standards such as Direct Media Interface with improved bandwidth, TV-out, high definition audio, eight USB ports, four-port PCI Express, and up to 2GB of DDR2 memory. Alviso will also support Intel High Definition Audio with low power capabilities to reduce power consumption by allowing the processor to remain in a sleep state while audio activity is happening.
Mobile PC sales are growing dramatically, with consumer laptop sales representing the fastest-growing sub-segment, according to analyst firm IDC.** “With the performance enhancements and new capabilities of Dothan and Sonoma and the growth of retail system availability, Intel Centrino mobile technology-based mobile PCs will become the dream consumer notebook,” said Chandrasekher.
Reshaping Mobile PCs to Reach New Users In addition to delivering innovative silicon building blocks, Intel works closely with its customers and other developers to help accelerate the development of new and innovative mobile PCs. The Mobile Platform Vision Guide (MPVG) provides a framework for developing future notebooks based on Intel Centrino mobile technology, and Intel’s concept mobile PCs serve as early demonstrations of the MPVG, highlighting innovation opportunities for the PC industry.
The 2004 MPVG featured Intel’s first example of Extended Mobile Access (EMA), which enables closed-lid instant access to e-mail and other information through a secondary display on the lid of notebook PCs based on Intel Centrino mobile technology. PC manufacturer Lenovo (Legend) demonstrated a model of its EMA-capable “Vela” laptop, and Insyde Software announced software that enables EMA functions, including allowing the laptop to enter a low-power mode when the lid is closed, while remaining connected to a wireless enterprise network.
To demonstrate 2005 mobile platform concepts, Intel has developed three concept mobile PCs, code-named “Florence.” The 12-inch model features EMA functionality and converts from a laptop to a tablet PC, allowing maximum flexibility to balance office and mobile demands. The 15.4-inch model is designed to enhance worker productivity with fingerprint and smartcard security, built-in array microphones and camera for collaboration, and EMA functionality. The 17-inch Mobile Entertainment PC allows users to communicate and be entertained around the home with a wide-screen display in a sleek, portable design; a wireless Bluetooth* keyboard; built-in voice-over-IP handset and remote control; integrated array microphones and camera; and Intel High Definition Audio for high-quality sound.
Galvanising the Mobile Industry and Ecosystem Along with silicon innovation and visionary reshaping of the mobile PC, Intel also works with the industry to develop new and better computing specifications and enhance the mobile ecosystem. Intel and other members of the Standards Panel Working Group (SPWG) today announced the release of the SPWG 3.0 specification, designed to help improve the notebook PC display interchangeability and time to market. Additionally, Toshiba Matsushita Display Technology Co. announced the development of the world’s first 2.38-watt, 14.1-inch XGA and 2.7-watt, 14.1-inch SXGA+ display for mobile PCs, helping to further reduce laptop power consumption and enable longer battery life.
In support of Intel Centrino mobile technology, Intel is working with independent software developers to help optimise applications to run well in both connected and unconnected environments. Intel has also developed a new “runs great on Intel Centrino mobile technology” logo to help users identify software designed specifically for mobility. To participate, software must have online and offline capabilities and meet certain power management, performance or connectivity criteria.
To further enhance the end user’s wireless experience, Intel has also expanded its Wireless Verification Program (WVP) to include support for the 802.11g wireless standard. The WVP now includes more than 30,000 verified hotspots worldwide.
About IDF The Intel Developer Forum is the technology industry’s premier event for hardware and software developers. Held worldwide throughout the year, IDF brings together key industry players to discuss cutting-edge technology and products for PCs, servers, communications equipment, and handheld clients. For more information on IDF and Intel technology, visit http://developer.intel.com.
About Intel Corporation Intel, the world’s largest chip maker, is also a leading manufacturer of computer, networking and communications products. Additional information about Intel is available at www.intel.com/pressroom.
* Other names and brands may be claimed as the property of others. Intel, Centrino and Pentium are registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. **Source: IDC Worldwide Quarterly PC Tracker, Dec. 2003.
Note: Wireless connectivity and some features may require you to purchase additional software, services or external hardware. Availability of public wireless LAN access points limited. System performance measured by MobileMark* 2002. System performance, battery life, wireless performance and functionality will vary depending on your specific hardware and software configurations. See http://www.intel.com/products/centrino/more_info for more information.
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