Infineon Invests $960M in Wafer-Thin Semis

LONDON (03/31/2000) - Infineon Technologies AG will invest 1 billion euros (US$960 million) over the next three years in new 300 millimeter-diameter semiconductor wafer manufacturing operations in Dresden, Germany, the company said today.

The project will create 1,100 new jobs in the new plant, to be built next to its existing facility. Production activities will be conducted through a new company, called Infineon Technologies SC300 GmbH & Co. KG, which is a venture with the State of Saxony and M+W Zander, a German company specializing in the construction of semiconductor plants.

The company will use technology developed with Motorola Inc. in the new product, it said in a statement. Further details will be released at the official ground breaking for the new plant, in May.

Since September, 1999, Infineon has been fabricating 64M bit DRAM (dynamic RAM) using the 300 millimeter wafer technology. The larger wafers each hold up to two-and-a-half times the number of chips held by 200 millimeter wafers.

Last month, Intel Corp. announced that it would invest $250 million in the German semiconductor company. [See "Intel Investing $250 Million in Infineon," Feb. 22.]Infineon, in Munich, can be reached at +49-89-234-0 or at

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