Motorola, Koninklijke Philips Electronics NV and STMicroelectronics NV (ST) have signed an agreement which will see the three chip makers collaborate on the development of advanced chip-making technology.
The announcement expands on an agreement announced last month between ST, Philips and the world's largest contract chip maker, Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), to develop process technology for making chips.
Working with TSMC, the three chip makers will focus their joint R&D efforts on developing future process technology fromth 0.09 microns (90 nanometers) down to 0.032 microns over the next five years, they said in a joint statement.
The joint development program will be based in Crolles, France, at the 'Crolles 2' research and development center, which includes a 300-millimeter wafer fabrication line, established by ST and Philips.
Motorola, Philips and ST will share equally the cost of capital expenditure, R&D and wafer loads at the Crolles2 facility, the statement said. The three companies are expected to invest a total of US$1.4 billion in the joint R&D project by 2005.