Three additional manufacturers have joined a group of vendors focused on creating common specifications for CellularRAM, a memory chip designed for high-performance mobile phones.
Hynix Semiconductor, NanoAmp Solutions and Winbond Electronics have agreed to become members of the CellularRAM work group, which includes Cypress Semiconductor, Infineon Technologies and Micron Technology, the companies said Monday.
To date, the CellularRAM work group has developed three generations of specifications for low-power, PSRAM (pseudo-static RAM) chips ranging in densities of 16Mb to 256Mb. The group is currently working on a fourth specification.
The chips are designed for use in high-bandwidth mobile devices, such as 3G (third-generation) and 2.5G mobile handsets, but can also be used in any devices that require cache or buffered memory.